Australia, Jan. 10 -- Next Level Components Pty. Ltd., owns the trademark (2541109) for 'NLC Engineering' till May 29, 2035.
Status: registered:
Registered/protected
Class: 40 [custom manufacture of semiconductor circuits; custom manufacturing of semiconductor components, devices and circuits; custom manufacture of 3D printed toys for others; machining parts for others [machine shop services]; custom manufacturing of 3D printed toys; custom manufacturing of moulded components; 3D printing; custom manufacture of semiconductor components; metal stamping; custom manufacture of 3D printed toys; prototype fabrication of new products for others; metal finishing; custom manufacturing of mouldings not of metal; custom manufacture of semiconductor wafers; metal fabrication and finishing services; engraving of metal; application of coatings using chemical vapour deposition techniques; custom steel rolling and fabrication to the order and specification of others; rental of 3D printers; custom manufacturing of semiconductor circuits; treating of metal; application of wear-resistant coatings on metals and plastics; custom manufacturing of semiconductor components, devices and integrated circuits; processing of metal surfaces by precision grinding and abrasive polishing; metal plating; custom manufacture of semiconductor components, devices and integrated circuits; metal molding; machining parts for others; surface finishing of metal articles; 3D printing for others; custom 3D printing services for others; custom manufacturing of chips [integrated circuits] for others; metal treatment [stamping]; custom manufacture of moulded components; blow molding; metal pressing; metal forging; custom fabrication of counter tops; metal laminating; digital printing; casting of metal; metallizing; coating of metal surfaces using physical vapour deposition processes; custom manufacturing of semiconductor components; metal coating other than painting; metallising; metal treating; metal treatment; custom manufacture of semiconductor components, devices and circuits; custom manufacture of semiconductor devices; three-dimensional printing; 3D reproduction services; 3D printing services; metal brazing; custom 3D printing of toys for others; custom manufacturing and assembling services in relation to semiconductor parts and integrated circuit products; metal cutting; custom manufacturing of semiconductor devices; coating of metal surfaces using physical vapour deposition or chemical vapour deposition processes; millworking; treatment and coating of metal surfaces; coating of metal surfaces using chemical vapour deposition processes; coating of metal surfaces using physical vapor deposition processes; coating of metal surfaces using chemical vapor deposition processes; plating of metal; custom 3D printing for others; metal treating [forging]; metal welding; coating and surface finishing of machines and tools; application of coatings using thermal plasma spraying techniques; custom manufacturing of semiconductor wafers; metalworking; metal casting; 3D printing services for others; coating of metal surfaces using physical vapor deposition or chemical vapor deposition processes; custom manufacturing and assembling services relating to semiconductor parts and integrated circuits; molding of metals; metal moulding; treatment of metal]
Type of Mark: Word
Date of Acceptance: June 16, 2025
Registration Advertised: Jan. 9
For further details contact Next Level Components Pty. Ltd. .
The original document can be viewed at: https://search.ipaustralia.gov.au/trademarks/search/view/2541109.
Disclaimer: Curated by HT Syndication.
